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laser FPC depaneling -YSPE


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laser FPC depaneling-YSPE

Model:            YSPE
Size(mm):         730 X 810 X 1700
Power supply(v):  110/220
Depression(Pa):   0.45-0.70
Weight(Kg):       530/700


laser FPC depaneling -YSPE

1.Depaneling PCB/FPC by means of punching dies, to avoid micro-cracks caused by manual. 
2.Cast iron framework for rigidity. Punching dies are changeable. Easy set up of punching dies. 
3.Moveable lower die for easy loading and unloadingPCB punch die| FPC die| PCB punch mold| FPC mould

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