Product

FPC Laser Depaneling Machine / UV Laser Depaneling Machine-YSATM-4C


FPC Laser Depaneling Machine / UV Laser Depaneling Machine-YSATM-4C

   Usage :
Precision cutting of FPC and organic membrane covering board without molds or the protection plate. High-energy laser source and precise control of laser beams can improve the processing speed and the accuracy of processing results.

Feature:
1. Independent intellectual property rights of the control software, Humanized interface, complete functions and simple operation. 
2. Processing any graphic, cutting different thickness and different materials, stratified processing and complete synchronously 
3. Adopt high-performance ultraviolet light laser with short wave length, high beam quality and higher peak power properties. Because ultraviolet light is through decomposition, vaporization instead of melting to cutting the materials, so almost no burrs after processing, small thermal effect, no stratification, precise cutting effects, smooth, steep sidewall. 
4. Fixed sample by using Vacuum mode, without matrix protection plate, convenient and improving the processing efficiency. 
5. Used for a variety of substrate materials cutting, such as: Silicon, ceramics, glass, etc. 
6. Automatic correction, automatic positioning and multi board cutting function. Automatic board thickness measurement and compensation. Full stroke motor compensation function. Improved cutting accuracy, reduced horizontal vibration. Improved depth cutting accuracy. Improved efficiency in cutting complex patterns.
3.Specifications
Item Specification
MODELYSATM-4C
Laser Source355 nm All-solid-state UV laser cutting device,wavelength 355 nm
Laser Power10W
Maximum Processing Size,720 mm×540 mm(21″×28″)
XY Platform Maximum Operating Speed50 m/min
Positioning accuracy   ±3µm
Repeat accuracy   ±1µm
System Processing Precision  ±20µm
Galvanometer scanning range50mm X 50mm
Cutting Thickness      <1.0mm
PowerAC 220V/50Hz/2.2KW;380V/50Hz/5.5KW
Vacuum Requirements516m3/h
Overall Dimensions1818mm×2317 mm×1550 mm
Weight3500kg
Environmental Temperature20ºC±1ºC
Humidity<60%RH (No dew)
Ground Amplitude<5µm
Vibration Acceleration    <0.05G
Ground Pressure    2200 kgf/m2
Industry
specific control machine, computer equipped flexible processing software
Motion control card and industry machine control mode
100G
Equipped with 17 screens, 100G hard disk
standard G code, Gerber data, CAD-compatible
Laser Type:UV Laser
 Repeat Positioning Accuracy:0.001 Mm
Specification: CE
Applied Industry:Flexible Printed Circuit
Warranty:12 Months
Maximum Positioning Accuracy: 0.003 Mm

4.Cutting samples

      
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