Product

Flexible Modular Lead-free Wave Soldering Machine


Five Features
1.Compact structure and small footprint.
2.PC+PLC control system.
3.IR preheating, high thermal efficiency and uniform temperature.
4.Step motor control spraying, more stable and reliable.
5.Adopts small solder pot, reduces the cost.
 
Flexible Modular Lead-free Wave Soldering Machine 0
 
Built-in Spraying Device
 
Flexible Modular Lead-free Wave Soldering Machine 1
 
Drawer type module preheating unit
 
Flexible Modular Lead-free Wave Soldering Machine 2
 
Linkage inlet buffering
 
Flexible Modular Lead-free Wave Soldering Machine 3
 
Solder Pot with Cast iron Material
 
Flexible Modular Lead-free Wave Soldering Machine 4
 
1.Conveying system: Direct buffering input structure. Special stainless steel chain transmission, aluminum alloy rail unique design, durable;Conveying system: adopt segmental floating structure, effectively prevent guide rail deformation;
2.Preheating system: Drawer-type energy-saving design.IR preheating,PID mode temperature control ,the temperature accuracy can reach to ±2℃;the dropping temperature between preheating zone and soldering zone is ≤5℃;
3.Flux spraying system:Adopt precision control valve for digital regulation, convenient management. Nozzle movement is controlled by stepping motor.Flux automatic pressure supply, can make the spray flow quickly reach saturation, top exhaustin, filtration system;
4.The solder pot adopts external heating, it is made of cast iron, the inner surface is anticorrosive treatment, with two low-flow nozzle and low oxidation design;
5.Forced air cooling system;
6.PC+PLC control system. Windows7 operation system with Chinese/English operation interface. Processing profile and data auto saving function.Alarm for detecting the flux and solder level.
 
Flexible Modular Lead-free Wave Soldering Machine 5
 
01 Buffer system
02 Exhaust fan 
03 Flux spraying system
04 Pre-heater  
05 Solder pot lifting unit  
06 Dual wave solder pot   
07 Angle adjustment controller
08 Cooling system
09 Finger cleaning system
10 LCD  
 
Model No.YSL-300EYSL-320E
Dimension: L*W*H(mm)3385*1240*15403385*1190*1540
WeightApprox.1150kgApprox.1100kg
Power Supply3PH 380V 50HZ3PH 380V 50HZ
Start up Power28KW27KW
Normal Running Power7KW6.7KW
Control SystemPC+PLC
Spraying movementStep motor
Spraying Pressure0.2Mpa~0.4Mpa
Flux Flow ControlOption
Auto Flux FillingStandard
ExhaustingTop exhaust/
Exhausting Pipe Diameter(mm)Φ250
Exhaust fan power370W/
Preheating ModeIR
Temperature Control ModePID
Preheating Zone Quantity2
Preheating Zone Length(mm)1500
Preheating Temperature RangeRoom temperature~200℃
Warm-up Time(min)Approx.12min(setting: 150℃)
Width(mm)50~300
PCB Conveying DirectionL→R( Option:R→L)
Conveying Speed(mm/min)500~1800
Conveying Height(mm)750±20
Available Component Height(mm)Top120 Bottom15
Conveying Speed Control ModeClosed loop stepless speed regulation by inverter
FingerSpring Pressing Finger;D-40 Type Finger;Double-hook Finger;Heavy type double hook finger(Options)
Conveying Angle4~6°
Solder Pot TypeMechanical
Solder Pot MaterialCasting Iron material
Wave Height AdjustmentDigital Control by PC
Cooling typeAir cooling/
Solder Pot Heating Power9KW220V 9KW
Max Solder Pot Temperature300℃
Solder Pot CapacityApprox.350kg
Wave Driving Power180W*2 3PH 220 VAC
Solder Pot Warm-up TimeApprox.150min(setting: 250℃)
Temperature Control ModePID
Finger Cleaning SystemBrush/




YSL-300E
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