Full Automatic solder paste Printer YSL-T3 Plus

Features

1. Auto balance the squeegee pressure which is adjustable

2.Intelligent 2D detection

3.Dry and wet cleaning.Option:vacuumcleaning

4.Option: for thin board printing

5.Advanced mark point recognition technology and stable system capability

6.The first online calibration technology in China

 

 

Overall diagram

1.Rack module

2.Lifting module

3.Platform alignment module

4.Housing module

5.Image capture module

6.Stencil frame positioning module

7.Squeegee module

8.Display module

9.Cleaning module

10.Conveyor module

11.Air and power input

 

 

Technical parameters

 

 

Parameter		YSL-T3 Plus/YSL-T3 BTB/YSL-T3 Plus BTB
Basic Parameters	Screen Frame Size(mm)	520(×)×420(Y)-737(×)×737(Y)
		Thickness∶ 20-40mm
	Min PCB(mm)	50(×)×50(Y)mm
	Max PCB(mm)	400(X)×310(Y)
	Thickness	0.2mm～6mm( Use jig when pcb less than 0.4mm)
	Curve	<1%(Diagonal measurement)
	PCB backside Part Height	10mm
	Conveyor height	900±40mm
	Support	Magnetic support,Magnetic piece,Vacuum chamber(Option)
	Clamp	Side clamp(Standard),please read the option table
	Edge distance	PCB process edge ≥2.5mm
	Conveyor speed	0~1500mm/s,increment 1mm
	Conveyor belt	U type sync belt
	Stopper method	Air cylinder
	Stopper position	Set the PCB stopper position according to the size of board
	Flow direction	L-R,R-L,L-L,R-R depends on customer
Print System	Print speed	5-200mm/s adjustable
	Print head	Step motor drive scraper lifting
	Scraper	Steel scraper,rubber scraper(option)
	Scraper angle	60°
	Scraper pressure	0~20kg
View System	Substrate Separation	Three-section Substrate Separation；Speed∶0.1-20mm/s；Distance∶0-20mm
	Alignment position method	Mark Automatic aligning
	Camera	Germany BASLER,1/3”CCD,640*480pixel,pixel size 5.6μmx5.6μm
	Acquire image method	Upper/under double photo
	Camera light	Coaxial light,Ring light four kinds light can adjustable
	View range	9mm*7mm
	Mark dimensions	Diameter or Side length 1mm~2mm,allowable offset 10%
	Mark shape	Cir,Rec,or rhombus etc
	Mark position	PCB dedicated mark or PCB pad
	2D detection	Standard
Accuracy	Table adjusting range	X=±3mm,Y=±7mm,0=±1.5°
	Positional accuracy	±0.01mm
	Printing accuracy	±0.025mm
Time	Cycle time	<10s(ex print,cleaning time)
	Convert line time	<5min
	Programming time	<10min
Control System	Computer configuration	Industrial PC,Windows official system
	System language	Chinese /English
	Pre and next machine connection	SMEMA
	User authorization	User PW and Senior PW set
Cleaning System	Cleaning system	Dry and Wet(standard),vacuum model(optional)
	Liquid level detection	Liquid level auto alarm detection
Power Parameters	Main power supply	AC220V±10%50/60HZ Single phase
	Total power	About 3kw
	Main air supply	4.5～6kgf/cm2
	Machine weight	About 900Kg
	Machine dimensions	1140(L)×1380(W)×1530(H)mm(standard);1675(L)mm(Feed feeding module);1675(L)mm(Add connection module),2210(L)mm(Add material and connect module)
Option	Pneumatic top clamp	For PCB(thickness≤1mm)
	Top clamp + side clamp	For PCB(thickness≤1mm)
	Vacuum adsorption and clean	For PCB(thickness≤1mm)and FPC
	Auto tin added	Auto tin added
	Auto loading and unloading	Auto loading and unloading
	Flexible and universal support	For the Double-sided PCB(PCB backside parts Height ≤9mm)
	Automatic positioning of screen frame	Automatic positioning of screen frame
	PCB board thickness movement adjustment function	PCB board thickness is automatically adjusted
	Squeegee pressure feedback function	Real-time feedback of scraper pressure
	Air condition	Customer can buy by themselves
	The rest of solder paste on the stencil monitoring system	The rest of solder paste on the stencil monitoring system
	SPI close loop	SPI close loop
	UPS power off protection	UPS 15min power off protection
	Industry 4.0	Bar code trace function,Production analysis,etc