Product

Full Automatic Solder Paste Printing Machine YSL-K870

YSL-k870 meets 870*610mm printing process requirements



1.Image and optical system


Using uniform ring light and high brightness coaxial light,with promise brightness adjustment function,then all types of Mark points can be well recognized (Including the rugged Mark points),applicable for tin plating,coppering,gold plating,tin spraying,FPC and other types PCB with of different colors.With YUSH patent mathematical model,able to ensure high accuracy.




2.Cleaning system


YUSH cleaning system equipped with three cleaning methods: dry cleaning, wet cleaning. vacuum.which can be combined to use.It can also be cleaned by manual if customer do not need to use automatic cleaning to reduce the cleaning time and improve production efficiency. The newly wiping system ensures full contact with the stencil, increased vacuum suction can effectively eliminate the remaining paste in the mesh,which can achieve effective automatic cleaning function. CCD part and cleaning system is separated, when CCD working. CCD part independently move to reduce the servo motor load and improve the machine speed and accuracy.



3.Adjustable Stepping Motor-Programmable &Floating Print-Heads




4.Chinese/English Operating Interface


The machine adopts windows XP/win7 operating interface with YUSH user friendly software.Chinese/English selectable,Menu/Operating Journal/Breakdown Record/Breakdown Diagnosis/Error Analysis/Light Alarm etc




5.YUSH special adjustment jacking platform.


Stable and easy to adjust,it can quickly adjust the pin jacking height of PCB with different thickness.




6.2D Solder Paste Print Quality Inspection and Analysis System

The 2D system immediately detects solder paste deposition defects such as deviation, lack paste,miss paste,paste joint etc,and guarantees print quality.




Specifications
Machine Performance
Repeat Position Accuracy±0.01mm
Print Accuracy±0.025mm
NCP-CT (excluding cleaning and printing)<10.5 sec
HCP-CT (including cleaning and printing)25s/pcs
Process CT6min
Transversal CT4min
Substrate processing parameter
Maximum board size870*610mm
Minimum board size100*65mm
Board thickness0.4~8mm
Camera Mechanical range870*610mm
Maximum board weight10kg
Board edge clearance3.5mm
Board height23mm beyond the special top pin
Transport speed900+40mm
(Max)Transport speedSegment control,1500mm/s(Max)
Transport directionOne stage transport rail
Transmission directionLeft to right
Right to Left
In and out the same
Support SystemMagnetic Pin
(65mm)Support Block
(65mm)Patented over the top clamping
Board clampAutomatic to clamping
Side clamping
Adsorption function
Printing Parameters 
Print Speed10~150mm/sec
Print Pressure0.5~30Kg
Print ModeSingle or double scraper printing
Queegee TypeRubber/Squeegee Blade (angle45/55/60)
Snap-off0~20mm
Snap-Speed0~20mm/sec
The template frame size650*550mm~1100*950mm
Steel mesh positioning modeAutomatic Y orientation (compatible with manual compensation adjustment)
Cleaning Parameters
Cleaning SystemDry,Wet Vacuum three modes
High speed cleaningweave cleaning
Cleaning systemTop drip
Cleaning strokeAutomatic generation
Cleaning positionPost cleaning
Cleaning Speed10-200mm/sec
Cleaning fluid consumptionAuto&Manually adjustable
Cleaning paper consumptionAuto&Manually adjustable
Vision Parameters
CCD FOV10*8mm
Camera type130 Thousand CCD Digital camera
Camera SystemLock up/down optics structure
Camera Cycle time200 ms
Fiducial mark typesStandard Fiducial Mark Shape
round、square、diamond、cross
Pad and profile
Mark size0.1-6mm
Mark numberMax: 4pCs
Stay away numberMax: 1pcs
Machine parameter
Power SourceAC:220±10%,50/60Hz 3KW
Air Pressure4~6Kgf/cm2
Air ConsumptionAbout 5L/min
Operating Temperature-20℃~+45℃
Working environment humidity30%~60%
Machine dimension(without Tower light)1530(H)mm
Machine Length1590(L) mm
Machine Width1608(W)mm
Machine Weight ApproxApprox:1500Kg
Equipment load bearing requirements650Kg/㎡

The information contained in this manual contains general descriptions and performance characteristics that may be inconsistent with the product described.or may change with the development of technology.Specific performance characteristics and functions are binding only when an agreement is reached.

Dimensional appearance






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