High Efficiency Selective wave soldering For SMT Production Line

High Efficiency Selective wave soldering For SMT Production Line

Description

Specification items	YS-320Y/ YS-320YT
Applicable PCB board size	L*W : 50×50～320×250 mm
Applicable PCB board thickness	Substrate thickness：0.8～3 mm / Pin length：3mm 以内
Component height	Less than 100mm above the substrate / Less than 50mm below the substrate
Substrate shape and conditions	1. Substrate placement edge: more than 3mm from the substrate process edge. \ n2. The weight including components is 5KG The following 3. Substrate bending: less than 0.5mm
Tin furnace	Tin furnace material/capacity: All-titanium alloy material / 12KG Tin bath capacity: Power: 4*500W, 2KW
Preheating power	Infrared preheating 1KW
Total power	AC 220V 3.5KW
N2 Requirements	Nitrogen purity：99.999% Pressure/Consumption：0.5MPa / 20ℓ/min～30ℓ/min / 1.2 cubic meters
Flux nozzle	0.5mm precision fluid nozzle imported from Japan
Flux capacity	2 L
Gas source	0.5-0.7Mpa
Nozzle inner diameter	φ 3mm~φ 20mm Customizable size
Peak height	Automatic alignment/height measurement
System control	PC+PLC（windows+Huichuan）
Programming software	Support programming for online or offline image production
Video surveillance	Real-time video monitoring makes it convenient to watch the welding effect
Power supply/power	Single-phase 220V±10 Starting power：3.5KW
Weight	120KG （Containing solder12KG）
YS-320YExternal dimensions	LWH 910×980×1350 mm （With a display）
YS-320YTExternal dimensions	LWH 910×980×1500 mm （Including the upper cover）

Preheat the top of the PCB board

A 1KW infrared heating tube is adopted to preheat the PCB board before soldering,

which meets the high temperature requirements of special components, reduces the thermal

shock of components, activates the activity of flux, improves the tin penetration

of component pins, and enhances the soldering quality

Preheat the bottom of the PCB board

Taking advantage of the fast heat conduction speed of infrared rays, the PCB board is preheated before soldering and maintained at the set frequency during soldering to prevent temperature drop of the PCB board during soldering.

It belongs to the design principle of "preheating + soldering" carried out simultaneously, which

improves the soldering efficiency and the tin penetration rate of components, and reduces the

thermal shock caused by the sudden heat of heat-sensitive components. The cleanliness ratio

of the PCB board after soldering is relatively high.

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