High Efficiency Desktop selective wave soldering YS-E320 For SMT Production Line

Specification items

YS-E320

Applicable PCB board size

L*W :  50×50～450×400   mm

Applicable PCB board thickness

Substrate thickness：0.8～3 mm   /  Pin length：Within 3mm

Component height

Less than 100mm above the substrate /  Less than 50mm below the substrate

Substrate shape and conditions

1.Substrate placement edge：The edge of the substrate process is more than 3mm

2The weight including components is less than 5 kilograms

3.The bending of the substrate: less than 0.5mm

Tin furnace

Tin furnace material/capacity：Stainless steel material / 10KG tin tank capacity：Power：4*500W   2 KW

N2 Requirements

Nitrogen purity：99.999%

Pressure/Consumption：0.5MPa   / 20ℓ/min～30ℓ/min /

1.2-1.5Cube H

Flux nozzle

Precision fluid nozzle

Flux capacity

2 L  （Manual liquid addition)

Gas source

0.5-0.7Mpa

Nozzle inner diameter

φ 3mm~φ 20mm Customizable size

Peak height

Automatic alignment/height measurement

System control

PC+PLC（windows+Huichuan）

Programming software

Support programming for drawing lines on pictures（Convenient and fast）

Power supply/power

Single-phase 220V±10%    Starting power：2.5KW

Weight

70KG  （Containing solder10KG）

External dimensions

L*W*H  730×800×840 mm