Model: YSPE Size(mm): 730 X 810 X 1700 Power supply(v): 110/220 Depression(Pa): 0.45-0.70 Weight(Kg): 530/700 FPC /PCB punching -(YSPE) 1.Depaneling PCB/FPC by means of punching dies, to avoid micro-cracks caused by manual. 2.Cast iron framework for rigidity. Punching dies are changeable. Easy set up of punching dies. 3.Moveable lower die for easy loading and unloadingPCB punch die| FPC die| PCB punch mold| FPC mould
Copyright @ YUSH Electronic Technology Co.,Ltd. Tel:0512-62751429(Ms.Eva Liu) Fax:0512-62751429 E-mail:sales@yushunli.com *Web site related material and resources are from the Internet, if infringement please inform us, we will remove within 24 hours.*