UV Laser Depaneling Machine for FPC Flexible Circuit -YSATM-4C

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Usage :
Precision cutting of FPC and organic membrane covering board without molds or the protection plate. High-energy laser source and precise control of laser beams can improve the processing speed and the accuracy of processing results.

Feature:
1. Independent intellectual property rights of the control software, Humanized interface, complete functions and simple operation.
2. Processing any graphic, cutting different thickness and different materials, stratified processing and complete synchronously
3. Adopt high-performance ultraviolet light laser with short wave length, high beam quality and higher peak power properties. Because ultraviolet light is through decomposition, vaporization instead of melting to cutting the materials, so almost no burrs after processing, small thermal effect, no stratification, precise cutting effects, smooth, steep sidewall.
4. Fixed sample by using Vacuum mode, without matrix protection plate, convenient and improving the processing efficiency.
5. Used for a variety of substrate materials cutting, such as: Silicon, ceramics, glass, etc.
6. Automatic correction, automatic positioning and multi board cutting function. Automatic board thickness measurement and compensation. Full stroke motor compensation function. Improved cutting accuracy, reduced horizontal vibration. Improved depth cutting accuracy. Improved efficiency in cutting complex patterns.
3.Specifications

Item	Specification
MODEL	YSATM-4C
Laser Source	355 nm All-solid-state UV laser cutting device,wavelength 355 nm
Laser Power	10W
Maximum Processing Size,	720 mm×540 mm(21″×28″)
XY Platform Maximum Operating Speed	50 m/min
Positioning accuracy	±3µm
Repeat accuracy	±1µm
System Processing Precision	±20µm
Galvanometer scanning range	50mm X 50mm
Cutting Thickness	<1.0mm
Power	AC 220V/50Hz/2.2KW;380V/50Hz/5.5KW
Vacuum Requirements	516m3/h
Overall Dimensions	1818mm×2317 mm×1550 mm
Weight	3500kg
Environmental Temperature	20ºC±1ºC
Humidity	<60%RH (No dew)
Ground Amplitude	<5µm
Vibration Acceleration	<0.05G
Ground Pressure	2200 kgf/m2
Industry specific control machine, computer equipped flexible processing software	Motion control card and industry machine control mode 100G Equipped with 17 screens, 100G hard disk standard G code, Gerber data, CAD-compatible

Laser Type:	UV Laser
Repeat Positioning Accuracy:	0.001 Mm
Specification:	CE
Applied Industry:	Flexible Printed Circuit
Warranty:	12 Months
Maximum Positioning Accuracy:	0.003 Mm

4.Cutting samples

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