Second: heat resistance test
Pre-preparation: PCB production board tin furnace
1, sampling 10 * 10cm of the substrate (or plywood, finished board) 5pcs; (including copper substrate without blistering layer phenomenon)
Substrate: 10cycle or more
Plywood: LOW CTE 150 10cycle or more
HTg material 10cycle above
Normal material 5cycle or more
Finished board: LOW CTE 150 5cycle or more
HTg material 5cycle above
Normal Material 3cycle Above
2, set the tin furnace temperature of 288 +/- 5 degrees, and the use of contact thermometer measurement correction;
3, the first brush with a soft brush dipping flux, applied to the board, and then take the crucian pliers cheek test plate immersed in the tin furnace, the time 10sec Remove the cooling to room temperature, visual blistering blister board there, this is 1cycle;
4, if the visual discovery of foam blasting problem, immediately stop the dip tin analysis initiation point f / m, if no problem, and then continue
Until the burst plate to 20 times as the end;
5, bubble at the need to slice analysis to understand the source of the detonation point, and take pictures.